ASML
4 articles
- India’s Semiconductor Tooling Cluster Extends Global OEM Supply Chains
Applied Materials’ $5 billion and Lam Research’s ₹10,000 crore India commitments establish a second manufacturing geography for global equipment OEMs. Engineering, qualification, and proprietary materials capture most of the economic rent, while dependence on Chinese-processed inputs remains the primary constraint on supply-chain resilience.
- China's Strategic Deficit: A Fiscal Crowding-Out Failure, Not a Confrontation Error
China's strategic deficit can be explained as a fiscal crowding-out problem: capital was absorbed by real estate and local government balance sheets before domestic semiconductor capabilities reached strategic self-sufficiency.
- The Thermodynamics of Strategic Decoupling
The semiconductor supply chain is not a policy debate — it is a physical constraint. Advanced packaging, equipment tooling, and rare earth processing cannot be duplicated instantaneously. The irreversible timeline for strategic decoupling is approximately 2028-2032.
- Semiconductor Packaging Bottlenecks: Why Advanced Chip Design Means Nothing Without Advanced Packaging
Advanced semiconductor packaging is the actual bottleneck on AI accelerator deployment — what it means for capital allocation?