CoWoS
5 articles
- The Mature-Node Scarcity Paradox
U.S. export controls aimed at leading-edge chips inadvertently created a pricing-power windfall in China's mature-node foundries. The mechanism: a deliberate policy line, state capital reallocation, and an unmodeled AI demand shock.
- The Compute Substrate Race: Where the U.S. and China Hit Different Walls
AI compute scarcity has migrated from fabrication to HBM, advanced packaging, grid access, and cooling. China is constrained upstream; the U.S. downstream.
- The Taiwan Strait Contingency: What Breaks First When the World's Foundry Hub Goes Dark
A 30-day Taiwan Strait closure is not a theoretical exercise — it is a supply chain stress test. The AI chips are the most resilient in the short run. The boring chips break first. The actual gating constraint may be energy, not fabrication.
- The Thermodynamics of Strategic Decoupling
The semiconductor supply chain is not a policy debate — it is a physical constraint. Advanced packaging, equipment tooling, and rare earth processing cannot be duplicated instantaneously. The irreversible timeline for strategic decoupling is approximately 2028-2032.
- Semiconductor Packaging Bottlenecks: Why Advanced Chip Design Means Nothing Without Advanced Packaging
Advanced semiconductor packaging is the actual bottleneck on AI accelerator deployment — what it means for capital allocation?