4 articles
The structural mechanics behind the closed-loop cooling pivot — why AI rack density, regulatory disclosure, and social license friction are converging to make evaporative cooling a stranded-asset risk in water-stressed basins.
AI compute scarcity has migrated from fabrication to HBM, advanced packaging, grid access, and cooling. China is constrained upstream; the U.S. downstream.
The semiconductor supply chain is not a policy debate — it is a physical constraint. Advanced packaging, equipment tooling, and rare earth processing cannot be duplicated instantaneously. The irreversible timeline for strategic decoupling is approximately 2028-2032.
Data-center capacity is constrained by the density at which waste heat can be captured, transported, and rejected, not by aggregate electricity generation alone.